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Surface and Edge Quality Variation in Precision Machining of Single Crystal and Polycrystalline Materials
Sangkee Min, UC Berkeley
Dae-Eun Lee, UC Berkeley
Arnaud de Grave, Laboratoire Sols-Solides-Structures, pôle Conception Intégrée, Domaine Universitaire, Grenoble
Carlos M. De Oliveira Valente, University of Sao Paulo, Brazil
Judy Lin, UC Berkeley
David A. Dornfeld
ABSTRACT: The surface and edge quality of single crystal and polycrystalline copper workpieces has been observed to vary significantly as a function of crystallographic orientation. At the precision scale, the chip formation process is influenced by the microstructure of the material, such as grain boundaries and grain orientation in polycrystalline materials, and crystallographic orientation in single-crystal materials. Such variation in the microstructure has a significant effect on the resulting surface, edge, and burr topography.
SUGGESTED CITATION: Sangkee Min, Dae-Eun Lee, Arnaud de Grave, Carlos M. De Oliveira Valente, Judy Lin, and David A. Dornfeld,
"Surface and Edge Quality Variation in Precision Machining of Single Crystal and Polycrystalline Materials"
(May 31, 2004).
Laboratory for Manufacturing and Sustainability.
Consortium on Deburring and Edge Finishing.
Paper sangkee_de_03.
http://repositories.cdlib.org/lma/codef/sangkee_de_03
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