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Luo, J., “Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales”, 2002-2003 LMA Reports, University of California at Berkeley, pp. 107-135.

Download the Paper (668 K, PDF file) - June 1, 2003 Tell a colleague about it. Printing Tips: Select 'print as image' in the Acrobat print dialog if you have trouble printing.

ABSTRACT:
Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Research efforts in CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically. In this paper, chemical mechanical planarization modeling is reviewed systematically, from particle scale to die and wafer scales.

SUGGESTED CITATION:
Jianfeng Luo and David A. Dornfeld, "Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales" (June 1, 2003). Laboratory for Manufacturing and Sustainability. Precision Manufacturing Group. Paper 2002_luo_1.
http://repositories.cdlib.org/lma/pmg/2002_luo_1