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Evans, J., Paul, E., Dornfeld, D., Lucca, D., Byrne, G., Tricard, M., Klocke, F., Dambon, O., and Mullany, B. (2003), “Material Removal Mechanisms in Lapping and Polishing”, STC “G” Keynote, CIRP Annals, 52, 2, pp. 611-633.

Download the Paper (886 K, PDF file) - January 1, 2003 Tell a colleague about it. Printing Tips: Select 'print as image' in the Acrobat print dialog if you have trouble printing.

ABSTRACT:
Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms, howeve, are poorly understood. Technological outputs (e.g., surface finish, sub-surface damage, part shape) and throughput of lapping and polishing processes are affected by a large number of variables. Individual processes are well controlled within individual enterprises, yet there appears to be little ability to predict process performance a priori. As a first step toward improving process modeling, this paper reviews the fundamental mechanisms of material removal in lapping and polishing processes and identifies key areas where further work is required.

SUGGESTED CITATION:
C. J. Evans, E. Paul, David Dornfeld, D. A. Lucca, G. Byrne, M. Tricard, F. Klocke, O. Dambon, and B. A. Mullany, "Material Removal Mechanisms in Lapping and Polishing " (January 1, 2003). Laboratory for Manufacturing and Sustainability. Precision Manufacturing Group. Paper evans_03_1.
http://repositories.cdlib.org/lma/pmg/evans_03_1