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Tripathi, S., Doyle, F. and Dornfeld, D. (2006), "Tribo-Chemical Modeling of Copper CMP", Proceedings of VLSI Multilevel Interconnection Conference (VMIC), Fremont CA, October, pp. 432-437.

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ABSTRACT:
We are developing an integrated tribo-chemical model of copper CMP that considers abrasive and pad properties, process parameters (speed, pressure etc.), and slurry chemistry to predict material removal rates. In this paper, the framework of the model is explained, and two important constituents of the model are presented: transient passivation behavior and characteristics of mechanical interactions.

SUGGESTED CITATION:
Shantanu Tripathi, Fiona Doyle, and David Dornfeld, "Tribo-Chemical Modeling of Copper CMP" (October 1, 2006). Laboratory for Manufacturing and Sustainability. Precision Manufacturing Group. Paper tripathi_06_2.
http://repositories.cdlib.org/lma/pmg/tripathi_06_2