•   •   •   •

Wang, C., Sherman, P., Chandra, A., and Dornfeld. D. (2005), “Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization", CIRP Annals, 54, 1, pp. 309-312.

Download the Paper (254 K, PDF file) - January 1, 2005 Tell a colleague about it. Printing Tips: Select 'print as image' in the Acrobat print dialog if you have trouble printing.

ABSTRACT:
The ability to predict material removal rates in chemical mechanical planarization (CMP) is an essential ingredient for low cost, high quality IC chips. Recently, models that address the slurry particles have been proposed. We address three such models. The first two differ only in how the number of active particles is computed. Both assume that pad asperities are identical and nonrandom. The third is dynamic in accommodating changing pad properties. For larger mean particle size (diameter), the role of the standard deviation of particle size distribution is uncertain. The dynamic behavior of the third model is compared with experimental observations.

SUGGESTED CITATION:
C Wang, A. Chandra, and David Dornfeld, "Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization" (January 1, 2005). Laboratory for Manufacturing and Sustainability. Precision Manufacturing Group. Paper wang_05_1.
http://repositories.cdlib.org/lma/pmg/wang_05_1